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| QFP-EP Exposed Pad Quad Flat Pack * 7 x 7mm to 24 x 24mm body sizes * 32 to 216 lead count * Lead pitch range from 0.80mm to 0.40mm FEATURES * Body Sizes: 7 x 7mm to 24 x 24mm * Package Height: 1.0mm (TQFP-EP) and 1.4mm (LQFP-EP) * Lead Counts: 32L to 216L * Lead Pitch: 0.40mm to 0.80mm * Wide range of open tool leadframe and die pad sizes available * JEDEC standard compliant * Lead-free and Green material sets available DESCRIPTION STATS ChipPAC's Exposed Pad Quad Flat Pack (QFP-EP) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC's QFP-EP family includes the Exposed Pad-Low Profile QFP (LQFP-EP) and the Exposed Pad-Thin QFP (TQFP-EP). These enhanced thermal packages are made possible by deep downset die pad leadframe design combined with well controlled low loop wirebonding and package warpage control during the molding process. APPLICATIONS * ASIC * DSP * Gate Array * Logic, Microprocessors/Controllers * Multimedia, PC Chipsets, Others www.statschippac.com QFP-EP Exposed Pad Quad Flat Pack SPECIFICATIONS Die Thickness Gold Wire Lead Finish Marking Packing Options 304-482m (12-19mils) range preferred 25/30m (1.0/1.2mils) diameter, 99.999% Au 85/15 Sn/Pb or Matte Tin Laser/ink JEDEC tray/tape and reel RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) JEDEC Level 3 -65C/150C, 1000 cycles 150C, 500 hrs 121C 100% RH, 2 atm, 168 hrs -55C/125C, 1000 cycles THERMAL PERFORMANCE, ja (C/W) Package 48L 64L 80L Body Size (mm) 7 x 7 x 1.0 10 x 10 x 1.0 12 x 12 x 1.0 Pad Size (mm) 5.5 x 5.5 6.5 x 6.5 7.2 x 7.2 Die Size (mm) 5.3 x 5.3 6.0 x 6.0 6.0 x 6.0 PCB Vias 25 36 36 Thermal Performance, ja (C/W) 26.9 24.0 23.0 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Lead (14 x 14mm, 100L) Total (14 x 14mm, 100L) Wire Lead (20 x 20mm, 144L) Total (20 x 20mm, 144L) 2 4.2 - 6.1 Length (mm) 2 4.4 - 5.9 Resistance (mOhms) 120 30.5 - 41.4 150.5 - 161.4 120 29.3 - 42.8 149.3 - 162.8 Inductance (nH) 1.65 1.52 - 2.07 3.17 - 3.72 1.65 1.47 - 2.14 3.12 - 3.79 Inductance Mutual (nH) 0.45 - 0.85 0.70 - 0.93 1.15 - 1.78 0.45 - 0.85 0.68 - 0.98 1.13 - 1.83 Capacitance (pF) 0.10 0.70 - 0.95 0.8 - 1.05 0.10 0.75 - 1.10 0.85 - 1.20 Capacitance Mutual (pF) 0.01 - 0.02 0.39 - 0.52 0.4 - 0.54 0.01 - 0.02 0.44 - 0.65 0.45 - 0.67 CROSS-SECTION TQFP-EP PACKAGE CONFIGURATIONS Package Size 0.80mm Lead Count 0.65mm 0.50mm 0.40mm TQFP-EP LQFP-EP 7 x 7 x 1.0 10 x 10 x 1.0 12 x 12 x 1.0 14 x 14 x 1.0 LQFP-EP 10 x 10 x 1.4 14 x 14 x 1.4 20 x 20 x 1.4 24 x 24 x 1.4 32 44, 48 52 64 64 96 - 52 64 80 80 128 - 48 64 80 100 64 100 144 - 100 164 216 Corporate Office Global Offices 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-43-351-3320 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2005. STATS ChipPAC Ltd. All rights reserved. January 2005 |
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